New smaller package FSOP8 (3.25 x 2.85mm 0.8mm pitch)

jm***

I came across a new package recently, FSOP8 (3.25 x 2.85mm 0.8mm pitch) used by LED drivers, (eg WS2814F).
Q:  Can the STC die fit into this package?
Image attached

Debu***

据说芯片比较大，可能放不下

神***

有量才会提供这种支持，关键我们需要在封装完后帮他测试，没量不考虑这些的

网***

应该就是SOT23-8大小的封装吧,
想体积小不如用现成的DFN-8或QFN-20封装

jm***

SOT23-8 is very similar, tho 25% thicker,
FSOP8 likely has larger die paddle area, otherwise WS2814F would be in SOT23-8 ?
DFN8 is not gull wing, and the exposed PAD means the routed PCB space is larger, as no vias can go under package.

Sandlo***

Seeing that you are using English, I feel that you should be a foreign friend, but my English is not good, so I translated it using Google Translate. I hope the original text plus the translation can help you.

看你用的是英语，感觉你应该是个外国友人，但我英语不好，所以就用谷歌翻译翻译了一下，希望原文加译文的形式能帮到你

Sandlo***

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首先，选择做哪种封装呢，有两个大方向：

一、做成直插封装（这里以PDIP40为例）

　　这种封装的针脚不但长（针脚要过孔），而且还大（这里是相较于其他同类的贴片封装而言的）。这就直接导致了 其封装体积 本身就不可能小到哪里去。但他的优点是：经典，成本较低，手工焊接、安装调试时非常方便。

二、做成贴片的样式（如你提到的SOT23-8 ）

　　这种封装的针脚可以做到短（不需过孔）而小巧，其封装的体积就可以做的更小。

我们比较一下优缺点后，就可发现：
　　虽然直插封装看起来又大又不方便，但考虑到他的经济性好、便于调试，使得它其实非常适合 中小型公司的工程师 或 一般硬件爱好者 使用在：
　　1. 中低频电路（ 如音频电路、模拟电路等）、
　　2. 需要频繁更换的元件（ 如可调电阻、开关等）、
　　3. 手工组装或小批量生产（对于原型开发或维修来说，直插式封装更方便）、
　　4. 对成本敏感的应用（直插式封装的成本相对较低）的场景下。
而贴片封装更适合在以下场景应用：
   1. 高密度集成电路： 如手机、电脑等小型电子产品
   2. 高频电路： 如射频电路、微波电路
   3. 大批量生产：贴片封装的自动化程度高，适合大批量生产
   4. 对产品尺寸和重量有严格要求的应用： 贴片封装可以使产品更小巧轻便

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看你用的是英语，感觉你应该是个外国友人，但我英语不好，所以就用谷歌翻译翻译了一下，希望原文加译文的形式能帮到你

其次，做哪种封装还要考虑芯片的应用场景再来选择封装针脚数：
　　功能简单，要求低（运算放大器）这类的就可以少给点；遇上 MCU 这种功能强大的就要多给点了。　　

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最后，要根据市场的需求，具体选择哪一种封装：
例如 AA-n 封装 都没人用，而 BB-n 封装 市场占有率高，肯定就优先考虑 BB-n 封装了。

Sandlo***

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First, there are two major directions for choosing which package to make:

1. External direct plug-in package (PDIP40 is used as an example here)

　　 The pins of the package are also long (the pins need to be through-holes), and they are also very large (this is in comparison with other similar patch packages before). This directly leads to the fact that the package volume itself cannot be very small. But its advantages are: classic, low cost, and very convenient for manual installation and debugging.

2. The style of the initial patch (such as the SOT23-8 you mentioned)

　　 The pins of the package can be short (no through-holes are required) and small, and the package volume can be made smaller.

After comparing the advantages and disadvantages, we can find that:

Although the plug-in package looks large and inconvenient, considering its good economy and easy debugging, it is actually very suitable for engineers in small and medium-sized companies or general hardware enthusiasts in:

1. Medium and low frequency circuits (such as audio circuits, analog circuits, etc.),

2. Components that need to be replaced frequently (such as adjustable resistors, switches, etc.),

3. Manual assembly or small batch production (for prototype development or maintenance, plug-in packaging is more convenient),

4. Cost-sensitive applications (the cost of plug-in packaging is relatively low) are as follows.
SMD packaging is more suitable for the following scenarios:
1. High-density integrated circuits: such as small electronic products such as mobile phones and computers
2. High-frequency circuits: such as radio frequency circuits and microwave circuits
3. Mass production: SMD packaging has a high degree of automation and is suitable for mass production
4. Applications with strict requirements on product size and weight: SMD packaging can make products more compact and convenient

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Secondly, the application of the chip should be considered when making which package. The number of package pins is as follows:

Simple functions and low requirements (aggression against the enemy) can be paid less; if you encounter a powerful function such as MCU, you will pay more. 　　

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Finally, the specific choice of package should be based on market demand:
For example, no one uses AA-n package, while BB-n package has a high market share, so BB-n package must be given priority.